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IBM picks BASF for 32nm chip
Pair to collaborate on new lithography processes
Shaun Nichols in California, vnunet.com25 Jun 2007
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IBM and
BASF have teamed
up to develop 32nm chips scheduled to hit the streets by 2010.
Under the agreement, BASF will provide research and personnel from its
chemical research unit in Germany. In parallel IBM will work out of its Yorktown
Heights facility in New York to develop a lithography process to produce the
32nm chip.
The aim is to combine new technologies from each company to develop a
lithography process precise enough to allow 32nm chip production.
Chipmakers use lithography to design and etch a chip's circuits. Smaller,
more precise, methods allow chipmakers to draw smaller circuits with more
transistors, resulting in higher performance and less energy consumption.
Big Blue is currently lagging behind Intel, which plans to release its
first 45nm
chips later this year.
IBM's
45nm
programme, which is being carried out in partnership with
Toshiba,
Sony and
AMD, will not
yield a 45nm chip until 2008. Intel hopes to unveil its first 32nm chips in
2009.
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Another round in the 'pitched battle' for software development 12 Jun 2007
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